MX23C2000PC-70
vs
HY27UF084G2-TPCB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MACRONIX INTERNATIONAL CO LTD
SK HYNIX INC
Part Package Code
DIP
TSOP1
Package Description
DIP, DIP32,.6
TSOP1,
Pin Count
32
48
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.51
Access Time-Max
70 ns
JESD-30 Code
R-PDIP-T32
R-PDSO-G48
JESD-609 Code
e0
Length
41.91 mm
18.4 mm
Memory Density
2097152 bit
4294967296 bit
Memory IC Type
MASK ROM
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
48
Number of Words
262144 words
536870912 words
Number of Words Code
256000
512000000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX8
512MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
TSOP1
Package Equivalence Code
DIP32,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.9022 mm
1.2 mm
Standby Current-Max
0.0001 A
Supply Current-Max
0.04 mA
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
2.7 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
12 mm
Base Number Matches
1
1
Programming Voltage
3.3 V
Type
SLC NAND TYPE
Compare MX23C2000PC-70 with alternatives
Compare HY27UF084G2-TPCB with alternatives