HY27UF084G2-TPCB
vs
VT231024-20PC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
VLSI TECHNOLOGY INC
Part Package Code
TSOP1
Package Description
TSOP1,
Pin Count
48
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
JESD-30 Code
R-PDSO-G48
R-PDIP-T28
Length
18.4 mm
Memory Density
4294967296 bit
1048560 bit
Memory IC Type
FLASH
MASK ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
48
28
Number of Words
536870912 words
131070 words
Number of Words Code
512000000
131070
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512MX8
131070X8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3.3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.5 mm
2.54 mm
Terminal Position
DUAL
DUAL
Type
SLC NAND TYPE
Width
12 mm
Base Number Matches
1
1
Rohs Code
Access Time-Max
200 ns
JESD-609 Code
e0
Output Characteristics
3-STATE
Package Equivalence Code
DIP28,.6
Supply Current-Max
0.1 mA
Terminal Finish
TIN LEAD
Compare HY27UF084G2-TPCB with alternatives
Compare VT231024-20PC with alternatives