MX23C2000PC-70
vs
TMS27PC256-100FML
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MACRONIX INTERNATIONAL CO LTD
TEXAS INSTRUMENTS INC
Part Package Code
DIP
Package Description
DIP, DIP32,.6
QCCJ, LDCC32,.5X.6
Pin Count
32
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
70 ns
100 ns
JESD-30 Code
R-PDIP-T32
R-PQCC-J32
JESD-609 Code
e0
Length
41.91 mm
13.97 mm
Memory Density
2097152 bit
262144 bit
Memory IC Type
MASK ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
262144 words
32768 words
Number of Words Code
256000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX8
32KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
QCCJ
Package Equivalence Code
DIP32,.6
LDCC32,.5X.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.9022 mm
3.56 mm
Standby Current-Max
0.0001 A
0.00025 A
Supply Current-Max
0.04 mA
0.03 mA
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
J BEND
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
15.24 mm
11.43 mm
Base Number Matches
1
1
I/O Type
COMMON
Output Characteristics
3-STATE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
13 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MX23C2000PC-70 with alternatives
Compare TMS27PC256-100FML with alternatives