MCP201T-I/P
vs
TJA1027T/20,118
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
NXP SEMICONDUCTORS
Part Package Code
DIP
SOIC
Package Description
DIP,
3.90 MM, GREEN, PLASTIC, MS-012, SOT96-1, SOP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDIP-T8
R-PDSO-G8
JESD-609 Code
e3
e3
Length
9.271 mm
4.9 mm
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Qualification Status
Not Qualified
Seated Height-Max
5.334 mm
1.75 mm
Supply Voltage-Nom
12 V
12 V
Surface Mount
NO
YES
Telecom IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
Temperature Grade
INDUSTRIAL
Terminal Finish
MATTE TIN
Tin (Sn)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
3.9 mm
Base Number Matches
1
1
Manufacturer Package Code
SOT96-1
ECCN Code
EAR99
Factory Lead Time
10 Weeks
Samacsys Manufacturer
NXP
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Screening Level
AEC-Q100
Time@Peak Reflow Temperature-Max (s)
30
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