MCP201T-I/P vs TJA1027T/20,118 feature comparison

MCP201T-I/P Microchip Technology Inc

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TJA1027T/20,118 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code DIP SOIC
Package Description DIP, 3.90 MM, GREEN, PLASTIC, MS-012, SOT96-1, SOP-8
Pin Count 8 8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T8 R-PDSO-G8
JESD-609 Code e3 e3
Length 9.271 mm 4.9 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified
Seated Height-Max 5.334 mm 1.75 mm
Supply Voltage-Nom 12 V 12 V
Surface Mount NO YES
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Temperature Grade INDUSTRIAL
Terminal Finish MATTE TIN Tin (Sn)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 1 1
Manufacturer Package Code SOT96-1
ECCN Code EAR99
Factory Lead Time 10 Weeks
Samacsys Manufacturer NXP
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Screening Level AEC-Q100
Time@Peak Reflow Temperature-Max (s) 30

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Compare TJA1027T/20,118 with alternatives