MCP201T-I/P
vs
935290083027
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP,
DIE,
Pin Count
8
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDIP-T8
R-XUUC-N13
JESD-609 Code
e3
Length
9.271 mm
Number of Functions
1
1
Number of Terminals
8
13
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
DIP
DIE
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
UNCASED CHIP
Qualification Status
Not Qualified
Seated Height-Max
5.334 mm
Supply Voltage-Nom
12 V
12 V
Surface Mount
NO
YES
Telecom IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
Temperature Grade
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
Terminal Position
DUAL
UPPER
Width
7.62 mm
Base Number Matches
1
1
Screening Level
AEC-Q100
Compare MCP201T-I/P with alternatives
Compare 935290083027 with alternatives