M38510/10302BCX vs LM111MD8 feature comparison

M38510/10302BCX Integrated Device Technology Inc

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LM111MD8 National Semiconductor Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP WAFER
Package Description CERAMIC, DIP-14 DIE, DIE OR CHIP
Pin Count 14
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 150 µA 0.15 µA
Input Offset Voltage-Max 4500 µV 3000 µV
JESD-30 Code R-GDIP-T14 X-XUUC-N
Neg Supply Voltage Limit-Max -7 V -18 V
Neg Supply Voltage-Nom (Vsup) -6 V -15 V
Number of Functions 2 1
Number of Terminals 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Code DIP DIE
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B 38535Q/M;38534H;883B
Supply Voltage Limit-Max 14 V 18 V
Supply Voltage-Nom (Vsup) 12 V 15 V
Surface Mount NO YES
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE NO LEAD
Terminal Position DUAL UPPER
Base Number Matches 3 2
Rohs Code Yes
Moisture Sensitivity Level 1
Output Type OPEN-DRAIN
Package Equivalence Code DIE OR CHIP
Peak Reflow Temperature (Cel) 260
Response Time-Nom 200 ns
Supply Current-Max 7 mA
Technology BIPOLAR
Time@Peak Reflow Temperature-Max (s) 40

Compare M38510/10302BCX with alternatives

Compare LM111MD8 with alternatives