LM111MD8 vs LM111WLQMLV feature comparison

LM111MD8 National Semiconductor Corporation

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LM111WLQMLV National Semiconductor Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code WAFER DFP
Package Description DIE, DIE OR CHIP DFP, FL10,.3
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 0.15 µA 0.15 µA
Input Offset Voltage-Max 3000 µV 4000 µV
JESD-30 Code X-XUUC-N R-GDFP-F10
Moisture Sensitivity Level 1 1
Neg Supply Voltage Limit-Max -18 V -18 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 1 1
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Type OPEN-DRAIN OPEN-COLLECTOR
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIE DFP
Package Equivalence Code DIE OR CHIP FL10,.3
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP FLATPACK
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Response Time-Nom 200 ns 200 ns
Screening Level 38535Q/M;38534H;883B MIL-PRF-38535 Class V
Supply Current-Max 7 mA 6 mA
Supply Voltage Limit-Max 18 V 18 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Form NO LEAD FLAT
Terminal Position UPPER DUAL
Time@Peak Reflow Temperature-Max (s) 40 40
Base Number Matches 2 2
Pin Count 10
Bias Current-Max (IIB) @25C 0.1 µA
JESD-609 Code e0
Number of Terminals 10
Seated Height-Max 2.032 mm
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 1.27 mm
Total Dose 50k Rad(Si) V
Width 6.3 mm

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