IS61DDP2B21M36A-400B4L
vs
UPD44322182F1-A44Y-FQ2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
NEC ELECTRONICS CORP
Part Package Code
BGA
BGA
Package Description
LBGA,
LBGA,
Pin Count
165
165
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
2.8 ns
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Length
15 mm
17 mm
Memory Density
37748736 bit
37748736 bit
Memory IC Type
DDR SRAM
CACHE SRAM
Memory Width
36
18
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
1048576 words
2097152 words
Number of Words Code
1000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1MX36
2MX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
1.89 V
3.465 V
Supply Voltage-Min (Vsup)
1.71 V
3.135 V
Supply Voltage-Nom (Vsup)
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
13 mm
15 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Additional Feature
PIPELINED ARCHITECTURE
JESD-609 Code
e0
Qualification Status
Not Qualified
Terminal Finish
TIN LEAD
Compare IS61DDP2B21M36A-400B4L with alternatives
Compare UPD44322182F1-A44Y-FQ2 with alternatives