IS61DDP2B21M36A-400B4L
vs
MT58LC128K32B4BG-6.8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
LBGA,
14 X 22 MM, BGA-119
Pin Count
165
119
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
6.8 ns
JESD-30 Code
R-PBGA-B165
R-PBGA-B119
Length
15 mm
22 mm
Memory Density
37748736 bit
4194304 bit
Memory IC Type
DDR SRAM
STANDARD SRAM
Memory Width
36
32
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
165
119
Number of Words
1048576 words
131072 words
Number of Words Code
1000000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX36
128KX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.4 mm
2.4 mm
Supply Voltage-Max (Vsup)
1.89 V
3.6 V
Supply Voltage-Min (Vsup)
1.71 V
3.135 V
Supply Voltage-Nom (Vsup)
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
13 mm
14 mm
Base Number Matches
1
1
Rohs Code
Clock Frequency-Max (fCLK)
125 MHz
I/O Type
COMMON
JESD-609 Code
e0
Number of Ports
1
Output Characteristics
3-STATE
Output Enable
YES
Package Equivalence Code
BGA119,7X17,50
Qualification Status
Not Qualified
Standby Current-Max
0.01 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.3 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Compare IS61DDP2B21M36A-400B4L with alternatives
Compare MT58LC128K32B4BG-6.8 with alternatives