IS61DDP2B21M36A-400B4L
vs
CY7C1372A-133BGC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
LBGA,
14 X 22 MM, 2.40 MM HEIGHT, FBGA-119
Pin Count
165
119
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
4.2 ns
JESD-30 Code
R-PBGA-B165
R-PBGA-B119
Length
15 mm
22 mm
Memory Density
37748736 bit
18874368 bit
Memory IC Type
DDR SRAM
ZBT SRAM
Memory Width
36
18
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
165
119
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX36
1MX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.4 mm
2.4 mm
Supply Voltage-Max (Vsup)
1.89 V
3.63 V
Supply Voltage-Min (Vsup)
1.71 V
3.135 V
Supply Voltage-Nom (Vsup)
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
13 mm
14 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Clock Frequency-Max (fCLK)
133 MHz
I/O Type
COMMON
JESD-609 Code
e0
Output Characteristics
3-STATE
Package Equivalence Code
BGA119,7X17,50
Qualification Status
Not Qualified
Standby Current-Max
0.02 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.28 mA
Terminal Finish
TIN LEAD
Compare IS61DDP2B21M36A-400B4L with alternatives
Compare CY7C1372A-133BGC with alternatives