Part Details for UPD44322182F1-A44Y-FQ2 by NEC Electronics Group
Overview of UPD44322182F1-A44Y-FQ2 by NEC Electronics Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Part Details for UPD44322182F1-A44Y-FQ2
UPD44322182F1-A44Y-FQ2 CAD Models
UPD44322182F1-A44Y-FQ2 Part Data Attributes
|
|
UPD44322182F1-A44Y-FQ2
NEC Electronics Group
Buy Now
Datasheet
|
Compare Parts:
UPD44322182F1-A44Y-FQ2
NEC Electronics Group
Cache SRAM, 2MX18, 2.8ns, CMOS, PBGA165, 15 X 17 MM, PLASTIC, FBGA-165
|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NEC ELECTRONICS CORP | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 2.8 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e0 | |
| Length | 17 mm | |
| Memory Density | 37748736 bit | |
| Memory IC Type | CACHE SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX18 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 3.465 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm |
Alternate Parts for UPD44322182F1-A44Y-FQ2
This table gives cross-reference parts and alternative options found for UPD44322182F1-A44Y-FQ2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of UPD44322182F1-A44Y-FQ2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY7C1372AV25-100BGC | ZBT SRAM, 1MX18, 5ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, FBGA-119 | Cypress Semiconductor | UPD44322182F1-A44Y-FQ2 vs CY7C1372AV25-100BGC |
| K7B401825A-TC65 | Cache SRAM, 256KX18, 6.5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 | Samsung Semiconductor | UPD44322182F1-A44Y-FQ2 vs K7B401825A-TC65 |
| MT58V2MV18FF-7.5 | Standard SRAM, 2MX18, 7.5ns, CMOS, PBGA165, 13 X 15 MM, MO-216, FBGA-165 | Micron Technology Inc | UPD44322182F1-A44Y-FQ2 vs MT58V2MV18FF-7.5 |
| UPD44164364F5-E30-EQ1 | DDR SRAM, 512KX36, 0.27ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, FBGA-165 | NEC Electronics Group | UPD44322182F1-A44Y-FQ2 vs UPD44164364F5-E30-EQ1 |
| MCM69R819ZP6 | 256KX18 CACHE SRAM, 3ns, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | Motorola Mobility LLC | UPD44322182F1-A44Y-FQ2 vs MCM69R819ZP6 |
| CY7C1305BV18-133BZC | QDR SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165 | Cypress Semiconductor | UPD44322182F1-A44Y-FQ2 vs CY7C1305BV18-133BZC |
| CY7C1381AV25-117AC | Standard SRAM, 512KX36, 7.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | Cypress Semiconductor | UPD44322182F1-A44Y-FQ2 vs CY7C1381AV25-117AC |
| KM718V787T-10 | Cache SRAM, 128KX18, 10ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 | Samsung Semiconductor | UPD44322182F1-A44Y-FQ2 vs KM718V787T-10 |
| 71V3578YS150BGGI | Cache SRAM, 256KX18, 3.8ns, CMOS, PBGA119, ROHS COMPLIANT, BGA-119 | Integrated Device Technology Inc | UPD44322182F1-A44Y-FQ2 vs 71V3578YS150BGGI |
| CY7C1143KV18-400BZC | QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | UPD44322182F1-A44Y-FQ2 vs CY7C1143KV18-400BZC |