IDT71V35761S200BGG vs 71V35761S200BGGI feature comparison

IDT71V35761S200BGG Integrated Device Technology Inc

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71V35761S200BGGI Integrated Device Technology Inc

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA PBGA
Package Description BGA, BGA-119
Pin Count 119 119
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.1 ns 3.1 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e1 e1
Length 22 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128KX36 128KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Seated Height-Max 2.36 mm
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Manufacturer Package Code BGG119
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260

Compare IDT71V35761S200BGG with alternatives

Compare 71V35761S200BGGI with alternatives