IDT71V35761S200BGG
vs
71V35761S200BGGI8
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
BGA
|
PBGA
|
| Package Description |
BGA,
|
|
| Pin Count |
119
|
119
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
3.1 ns
|
|
| Additional Feature |
PIPELINED ARCHITECTURE
|
|
| JESD-30 Code |
R-PBGA-B119
|
|
| JESD-609 Code |
e1
|
e1
|
| Length |
22 mm
|
|
| Memory Density |
4718592 bit
|
|
| Memory IC Type |
CACHE SRAM
|
CACHE SRAM
|
| Memory Width |
36
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
119
|
|
| Number of Words |
131072 words
|
|
| Number of Words Code |
128000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
128KX36
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
BGA
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY
|
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.36 mm
|
|
| Supply Voltage-Max (Vsup) |
3.465 V
|
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
14 mm
|
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Manufacturer Package Code |
|
BGG119
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
|
|
|
Compare IDT71V35761S200BGG with alternatives
Compare 71V35761S200BGGI8 with alternatives