71V35761S200BGGI vs MT58L128V36P1B-5 feature comparison

71V35761S200BGGI Integrated Device Technology Inc

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MT58L128V36P1B-5 Micron Technology Inc

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC MICRON TECHNOLOGY INC
Part Package Code PBGA BGA
Package Description BGA-119 BGA,
Pin Count 119 119
Manufacturer Package Code BGG119
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.1 ns 2.8 ns
Additional Feature PIPELINED
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e1 e1
Memory Density 4718592 bit 4718592 bit
Memory IC Type CACHE SRAM STANDARD SRAM
Memory Width 36 36
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128KX36 128KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Supply Voltage-Max (Vsup) 3.465 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Base Number Matches 1 2
Length 22 mm
Qualification Status Not Qualified
Seated Height-Max 2.4 mm
Terminal Pitch 1.27 mm
Width 14 mm

Compare 71V35761S200BGGI with alternatives

Compare MT58L128V36P1B-5 with alternatives