71V35761S200BGGI
vs
MT58L128V36P1B-5
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
PBGA
BGA
Package Description
BGA-119
BGA,
Pin Count
119
119
Manufacturer Package Code
BGG119
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3.1 ns
2.8 ns
Additional Feature
PIPELINED
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
JESD-609 Code
e1
e1
Memory Density
4718592 bit
4718592 bit
Memory IC Type
CACHE SRAM
STANDARD SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
119
119
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
128KX36
128KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Supply Voltage-Max (Vsup)
3.465 V
3.6 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
2
Length
22 mm
Qualification Status
Not Qualified
Seated Height-Max
2.4 mm
Terminal Pitch
1.27 mm
Width
14 mm
Compare 71V35761S200BGGI with alternatives
Compare MT58L128V36P1B-5 with alternatives