HY27UF084G2-TPCB
vs
LH530800A-YD-50
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
SHARP CORP
Part Package Code
TSOP1
Package Description
TSOP1,
0.600 INCH, PLASTIC, DIP-32
Pin Count
48
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
JESD-30 Code
R-PDSO-G48
R-PDIP-T32
Length
18.4 mm
41 mm
Memory Density
4294967296 bit
1048576 bit
Memory IC Type
FLASH
MASK ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
48
32
Number of Words
536870912 words
131072 words
Number of Words Code
512000000
128000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512MX8
128KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3.3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
5.2 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
2.6 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.5 mm
2.54 mm
Terminal Position
DUAL
DUAL
Type
SLC NAND TYPE
Width
12 mm
15.24 mm
Base Number Matches
1
1
Access Time-Max
50 ns
Supply Current-Max
0.035 mA
Compare HY27UF084G2-TPCB with alternatives
Compare LH530800A-YD-50 with alternatives