HY27UF084G2-TPCB
vs
MX27C1024MC-55
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
MACRONIX INTERNATIONAL CO LTD
Part Package Code
TSOP1
SOIC
Package Description
TSOP1,
SOP, SOP40,.56
Pin Count
48
40
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.71
JESD-30 Code
R-PDSO-G48
R-PDSO-G40
Length
18.4 mm
26.06 mm
Memory Density
4294967296 bit
1048576 bit
Memory IC Type
FLASH
OTP ROM
Memory Width
8
16
Number of Functions
1
1
Number of Terminals
48
40
Number of Words
536870912 words
65536 words
Number of Words Code
512000000
64000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512MX8
64KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3.3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
3 mm
Supply Voltage-Max (Vsup)
3.6 V
5.25 V
Supply Voltage-Min (Vsup)
2.7 V
4.75 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
DUAL
DUAL
Type
SLC NAND TYPE
Width
12 mm
11.3 mm
Base Number Matches
1
1
Rohs Code
Access Time-Max
55 ns
I/O Type
COMMON
JESD-609 Code
e0
Output Characteristics
3-STATE
Package Equivalence Code
SOP40,.56
Standby Current-Max
0.0001 A
Supply Current-Max
0.04 mA
Terminal Finish
TIN LEAD
Compare HY27UF084G2-TPCB with alternatives
Compare MX27C1024MC-55 with alternatives