GD80960JA33 vs GD80960JT100 feature comparison

GD80960JA33 Intel Corporation

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GD80960JT100 Intel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Part Package Code BGA BGA
Package Description BGA, BGA196(UNSPEC) BGA, BGA196(UNSPEC)
Pin Count 196 196
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 33.3 MHz 33.3 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B196 S-PBGA-B196
Low Power Mode YES YES
Number of Terminals 196 196
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA196(UNSPEC) BGA196(UNSPEC)
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Speed 33 MHz 100 MHz
Supply Current-Max 320 mA 600 mA
Supply Voltage-Max 3.45 V 3.45 V
Supply Voltage-Min 3.15 V 3.15 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Rohs Code No
Moisture Sensitivity Level 1

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