GD80960JT100
vs
MCF52277CVM160
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Not Recommended
Ihs Manufacturer
INTEL CORP
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
BGA, BGA196(UNSPEC)
15 X 15 MM, ROHS COMPLIANT, MAPBGA-196
Pin Count
196
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
24
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
33.3 MHz
66.67 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B196
S-PBGA-B196
Low Power Mode
YES
NO
Moisture Sensitivity Level
1
3
Number of Terminals
196
196
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LFBGA
Package Equivalence Code
BGA196(UNSPEC)
BGA196,14X14,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Speed
100 MHz
166.67 MHz
Supply Current-Max
600 mA
0.7 mA
Supply Voltage-Max
3.45 V
1.6 V
Supply Voltage-Min
3.15 V
1.4 V
Supply Voltage-Nom
3.3 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
2
Factory Lead Time
13 Weeks
JESD-609 Code
e1
Length
15 mm
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.7 mm
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Pitch
0.5 mm
Time@Peak Reflow Temperature-Max (s)
40
Width
15 mm
Compare GD80960JT100 with alternatives
Compare MCF52277CVM160 with alternatives