GD80960JA33
vs
MCF5232CVM150
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
MOTOROLA INC
Part Package Code
BGA
Package Description
BGA, BGA196(UNSPEC)
MAPBGA-196
Pin Count
196
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
24
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
33.3 MHz
75 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B196
S-PBGA-B196
Low Power Mode
YES
YES
Number of Terminals
196
196
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA196(UNSPEC)
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Speed
33 MHz
150 MHz
Supply Current-Max
320 mA
Supply Voltage-Max
3.45 V
1.65 V
Supply Voltage-Min
3.15 V
1.35 V
Supply Voltage-Nom
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
4
Length
15 mm
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Seated Height-Max
1.75 mm
Temperature Grade
INDUSTRIAL
Terminal Pitch
1 mm
Width
15 mm
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