GD80960JA33
vs
MCF5274LCVM166
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA, BGA196(UNSPEC)
ROHS COMPLIANT, MAPBGA-196
Pin Count
196
196
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
5A992
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
24
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
33.3 MHz
83 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B196
S-PBGA-B196
Low Power Mode
YES
YES
Number of Terminals
196
196
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA196(UNSPEC)
BGA196,14X14,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Qualification Status
Not Qualified
Not Qualified
Speed
33 MHz
166 MHz
Supply Current-Max
320 mA
175 mA
Supply Voltage-Max
3.45 V
1.6 V
Supply Voltage-Min
3.15 V
1.4 V
Supply Voltage-Nom
3.3 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
2
Pbfree Code
Rohs Code
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Length
15 mm
Moisture Sensitivity Level
3
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.6 mm
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER OVER NICKEL
Terminal Pitch
1 mm
Time@Peak Reflow Temperature-Max (s)
40
Width
15 mm
Compare GD80960JA33 with alternatives
Compare MCF5274LCVM166 with alternatives