DS0026MDC
vs
DS0056CN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Package Description
DIE, DIE OR CHIP
MINI, PLASTIC, DIP-8
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Category CO2 Kg
11.9
Compliance Temperature Grade
Commercial: +0C to +70C
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
X-XUUC-N
R-PDIP-T8
Logic IC Type
LOW SKEW CLOCK DRIVER
LOW SKEW CLOCK DRIVER
Max I(ol)
0.001 A
0.001 A
Number of Functions
2
2
Number of Inverted Outputs
1
1
Number of True Outputs
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
DIP
Package Equivalence Code
DIE OR CHIP
DIP8,.3
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
10 V
20 V
Supply Voltage-Min (Vsup)
5 V
10 V
Surface Mount
YES
NO
Technology
MOS
MOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
UPPER
DUAL
Base Number Matches
1
4
Rohs Code
Part Package Code
DIP
Pin Count
8
Family
DS00
JESD-609 Code
e0
Length
9.779 mm
Number of Terminals
8
Propagation Delay (tpd)
12 ns
Seated Height-Max
5.08 mm
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Width
7.62 mm
fmax-Min
10 MHz
Compare DS0026MDC with alternatives
Compare DS0056CN with alternatives