DS0026MDC
vs
7800802GX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
MOTOROLA INC
Package Description
DIE, DIE OR CHIP
,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
X-XUUC-N
O-MBCY-W8
Logic IC Type
LOW SKEW CLOCK DRIVER
LOW SKEW CLOCK DRIVER
Max I(ol)
0.001 A
Number of Functions
2
2
Number of Inverted Outputs
1
1
Number of True Outputs
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
UNSPECIFIED
METAL
Package Code
DIE
BCY
Package Equivalence Code
DIE OR CHIP
CAN8,.2
Package Shape
UNSPECIFIED
ROUND
Package Style
UNCASED CHIP
CYLINDRICAL
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
10 V
20 V
Supply Voltage-Min (Vsup)
5 V
10 V
Surface Mount
YES
NO
Technology
MOS
MOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
NO LEAD
WIRE
Terminal Position
UPPER
BOTTOM
Base Number Matches
2
4
Part Package Code
BCY
Pin Count
8
Family
DS00
Number of Terminals
8
Propagation Delay (tpd)
18 ns
Screening Level
MIL-STD-883
Compare DS0026MDC with alternatives
Compare 7800802GX with alternatives