DS0026MDC
vs
7800802CA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
ROCHESTER ELECTRONICS LLC
Package Description
DIE, DIE OR CHIP
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
X-XUUC-N
R-GDIP-T14
Logic IC Type
LOW SKEW CLOCK DRIVER
LOW SKEW CLOCK DRIVER
Max I(ol)
0.001 A
Number of Functions
2
2
Number of Inverted Outputs
1
Number of True Outputs
1
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
UNSPECIFIED
CERAMIC, GLASS-SEALED
Package Code
DIE
DIP
Package Equivalence Code
DIE OR CHIP
DIP14,.3
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
10 V
20 V
Supply Voltage-Min (Vsup)
5 V
10 V
Surface Mount
YES
NO
Technology
MOS
MOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
UPPER
DUAL
Base Number Matches
2
4
Part Package Code
DIP
Pin Count
14
Family
DS00
Number of Terminals
14
Propagation Delay (tpd)
18 ns
Screening Level
MIL-STD-883
Terminal Pitch
2.54 mm
Compare DS0026MDC with alternatives
Compare 7800802CA with alternatives