AM26LS31DC vs AM26LS31MF feature comparison

AM26LS31DC Rochester Electronics LLC

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AM26LS31MF NXP Semiconductors

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Package Description DIP, DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output YES YES
Driver Number of Bits 4 4
Input Characteristics STANDARD STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard EIA-422; FED STD 1020 EIA-422; FED STD 1020
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Length 19.431 mm 19.535 mm
Number of Functions 4 4
Number of Terminals 16 16
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Transmit Delay-Max 30 ns 20 ns
Width 7.62 mm 7.62 mm
Base Number Matches 5 3
Part Package Code DIP
Pin Count 16
Output Characteristics 3-STATE
Output Polarity COMPLEMENTARY
Qualification Status Not Qualified
Supply Current-Max 80 mA

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