AM26LS31DC
vs
DS26C31MMW8
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MOTOROLA INC
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
Package Description
DIP, DIP16,.3
DIE,
Pin Count
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Differential Output
YES
YES
Driver Number of Bits
4
4
High Level Input Current-Max
0.00002 A
Input Characteristics
STANDARD
STANDARD
Interface IC Type
LINE DRIVER
LINE DRIVER
Interface Standard
EIA-422; FED STD 1020
EIA-422
JESD-30 Code
R-GDIP-T16
X-XUUC-N
JESD-609 Code
e0
Length
19.495 mm
Number of Functions
4
4
Number of Terminals
16
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Out Swing-Min
2 V
Output Characteristics
3-STATE
Output Polarity
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
UNSPECIFIED
Package Code
DIP
DIE
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
IN-LINE
UNCASED CHIP
Qualification Status
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
BIPOLAR
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
Terminal Position
DUAL
UPPER
Transmit Delay-Max
20 ns
14 ns
Width
7.62 mm
Base Number Matches
5
3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare AM26LS31DC with alternatives
Compare DS26C31MMW8 with alternatives