AM26LS31DC vs DS26C31TMDC feature comparison

AM26LS31DC Rochester Electronics LLC

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DS26C31TMDC National Semiconductor Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIE, DIE OR CHIP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output YES YES
Driver Number of Bits 4 4
Input Characteristics STANDARD STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard EIA-422; FED STD 1020 EIA-422
JESD-30 Code R-GDIP-T16 X-XUUC-N
Length 19.431 mm
Number of Functions 4 4
Number of Terminals 16
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP16,.3 DIE OR CHIP
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Seated Height-Max 5.08 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology BIPOLAR CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Transmit Delay-Max 30 ns 11 ns
Width 7.62 mm
Base Number Matches 5 3
Rohs Code Yes
High Level Input Current-Max 0.000001 A
Moisture Sensitivity Level 1
Out Swing-Min 2 V
Output Characteristics 3-STATE
Qualification Status Not Qualified
Receive Delay-Max

Compare AM26LS31DC with alternatives

Compare DS26C31TMDC with alternatives