AM26LS31DC
vs
AM26LS32JC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
ADVANCED MICRO DEVICES INC
|
| Package Description |
DIP, DIP16,.3
|
QCCJ, LDCC20,.4SQ
|
| Reach Compliance Code |
unknown
|
unknown
|
| Differential Output |
YES
|
|
| Driver Number of Bits |
4
|
|
| High Level Input Current-Max |
0.00002 A
|
|
| JESD-30 Code |
R-XDIP-T16
|
S-PQCC-J20
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Out Swing-Min |
2 V
|
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Equivalence Code |
DIP16,.3
|
LDCC20,.4SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Power Supplies |
5 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Transmit Delay-Max |
20 ns
|
|
| Base Number Matches |
5
|
2
|
| Part Package Code |
|
QLCC
|
| Pin Count |
|
20
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Input Characteristics |
|
DIFFERENTIAL SCHMITT TRIGGER
|
| Interface IC Type |
|
LINE RECEIVER
|
| Interface Standard |
|
EIA-422; EIA-423; FED STD 1020; FED STD 1030
|
| Length |
|
8.9662 mm
|
| Number of Functions |
|
4
|
| Output Low Current-Max |
|
0.008 A
|
| Output Polarity |
|
TRUE
|
| Receive Delay-Max |
|
25 ns
|
| Receiver Number of Bits |
|
4
|
| Seated Height-Max |
|
4.572 mm
|
| Supply Current-Max |
|
70 mA
|
| Supply Voltage-Max |
|
5.25 V
|
| Supply Voltage-Min |
|
4.75 V
|
| Width |
|
8.9662 mm
|
|
|
|
Compare AM26LS32JC with alternatives