A3P060-QNG132I
vs
A3P060-1VQ100T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, GREEN, QFN-132
0.50 MM PITCH, VQFP-100
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-XBCC-B132
S-PQFP-G100
Length
8 mm
14 mm
Moisture Sensitivity Level
2
Number of CLBs
1536
1536
Number of Equivalent Gates
60000
60000
Number of Inputs
80
71
Number of Outputs
80
71
Number of Terminals
132
100
Operating Temperature-Max
100 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1536 CLBS, 60000 GATES
1536 CLBS, 60000 GATES
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVBCC
TFQFP
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
FLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.8 mm
1.2 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
BUTT
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
8 mm
14 mm
Base Number Matches
3
1
Clock Frequency-Max
350 MHz
Number of Logic Cells
1536
Package Equivalence Code
TQFP100,.63SQ
Screening Level
AEC-Q100
Compare A3P060-QNG132I with alternatives
Compare A3P060-1VQ100T with alternatives