A3P060-QNG132I
vs
A3P060-QN132
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICROSEMI CORP
ACTEL CORP
Package Description
8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, GREEN, QFN-132
0.50 MM PITCH, QFN-132
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
JESD-30 Code
S-XBCC-B132
S-XQCC-N132
Length
8 mm
Moisture Sensitivity Level
2
Number of CLBs
1536
Number of Equivalent Gates
60000
60000
Number of Inputs
80
Number of Outputs
80
Number of Terminals
132
132
Operating Temperature-Max
100 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
1536 CLBS, 60000 GATES
60000 GATES
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
HVBCC
QCCN
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.8 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BUTT
NO LEAD
Terminal Pitch
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
8 mm
Base Number Matches
2
2
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