A3P060-QNG132I vs A3P060-QN132 feature comparison

A3P060-QNG132I Microsemi Corporation

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A3P060-QN132 Actel Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROSEMI CORP ACTEL CORP
Package Description 8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, GREEN, QFN-132 0.50 MM PITCH, QFN-132
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
JESD-30 Code S-XBCC-B132 S-XQCC-N132
Length 8 mm
Moisture Sensitivity Level 2
Number of CLBs 1536
Number of Equivalent Gates 60000 60000
Number of Inputs 80
Number of Outputs 80
Number of Terminals 132 132
Operating Temperature-Max 100 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1536 CLBS, 60000 GATES 60000 GATES
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code HVBCC QCCN
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.8 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BUTT NO LEAD
Terminal Pitch 0.5 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 8 mm
Base Number Matches 2 2

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