74LVC3G17GM,125
vs
74LVC3G17GM,115
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
QFN
QFN
Package Description
1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, XQFN-8
1.60 X 1.60 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-255, SOT902-1, XQFN-8
Pin Count
8
8
Manufacturer Package Code
SOT902-2
SOT902-2
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PBCC-B8
S-PQCC-N8
JESD-609 Code
e4
e4
Length
1.95 mm
1.6 mm
Logic IC Type
BUFFER
BUFFER
Moisture Sensitivity Level
1
1
Number of Functions
3
3
Number of Inputs
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VBCC
VQCCN
Package Equivalence Code
LCC8,.06SQ,20
LCC8,.06SQ,20
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER, VERY THIN PROFILE
CHIP CARRIER, VERY THIN PROFILE
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
13.1 ns
13.1 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
YES
YES
Seated Height-Max
0.5 mm
0.5 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
NICKEL PALLADIUM GOLD
Terminal Form
BUTT
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
0.95 mm
1.6 mm
Base Number Matches
2
2
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Prop. Delay@Nom-Sup
7.1 ns
Compare 74LVC3G17GM,125 with alternatives
Compare 74LVC3G17GM,115 with alternatives