74LVC3G17GM,115 vs 935278935115 feature comparison

74LVC3G17GM,115 Nexperia

Buy Now Datasheet

935278935115 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Transferred
Part Package Code QFN
Package Description VQCCN, LCC8,.06SQ,20 VSON,
Pin Count 8
Manufacturer Package Code SOT902-2
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Nexperia
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code S-PQCC-N8 R-PDSO-N8
JESD-609 Code e4 e3
Length 1.6 mm 1.95 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Number of Functions 3 3
Number of Inputs 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VQCCN VSON
Package Equivalence Code LCC8,.06SQ,20
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 7.1 ns
Propagation Delay (tpd) 13.1 ns 13.1 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD TIN
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.6 mm 1 mm
Base Number Matches 2 2
Ihs Manufacturer NXP SEMICONDUCTORS
Reach Compliance Code unknown

Compare 74LVC3G17GM,115 with alternatives