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74LVC3G17GM,115 vs 74LVC3G17DP,125 feature comparison

74LVC3G17GM,115 NXP Semiconductors

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74LVC3G17DP,125 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QFN TSSOP
Package Description 1.60 X 1.60 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-255, SOT902-1, XQFN-8 3 MM, PLASTIC, SOT505-2, TSSOP-8
Pin Count 8 8
Manufacturer Package Code SOT902-2 SOT505-2
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code S-PQCC-N8 S-PDSO-G8
JESD-609 Code e4 e4
Length 1.6 mm 3 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.024 A
Moisture Sensitivity Level 1 1
Number of Functions 3 3
Number of Inputs 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VQCCN TSSOP
Package Equivalence Code LCC8,.06SQ,20 TSSOP8,.16
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 7.1 ns
Propagation Delay (tpd) 13.1 ns 13.1 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.6 mm 3 mm
Base Number Matches 2 2
Logic » Gates
Logic » Gates

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