74LVC3G17GM,125
vs
935278935115
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
QFN
Package Description
1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, XQFN-8
VSON,
Pin Count
8
Manufacturer Package Code
SOT902-2
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PBCC-B8
R-PDSO-N8
JESD-609 Code
e4
e3
Length
1.95 mm
1.95 mm
Logic IC Type
BUFFER
BUFFER
Moisture Sensitivity Level
1
1
Number of Functions
3
3
Number of Inputs
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VBCC
VSON
Package Equivalence Code
LCC8,.06SQ,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, VERY THIN PROFILE
SMALL OUTLINE, VERY THIN PROFILE
Packing Method
TR
TR, 7 INCH
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
13.1 ns
13.1 ns
Qualification Status
Not Qualified
Schmitt Trigger
YES
Seated Height-Max
0.5 mm
0.5 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN
Terminal Form
BUTT
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
0.95 mm
1 mm
Base Number Matches
2
2
Compare 74LVC3G17GM,125 with alternatives
Compare 935278935115 with alternatives