74LVC3G17GM,125
vs
74LVC3G17GM
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
QFN
Package Description
1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, XQFN-8
,
Pin Count
8
Manufacturer Package Code
SOT902-2
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
LVC/LCX/Z
JESD-30 Code
R-PBCC-B8
JESD-609 Code
e4
Length
1.95 mm
Logic IC Type
BUFFER
Moisture Sensitivity Level
1
Number of Functions
3
Number of Inputs
1
Number of Terminals
8
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
VBCC
Package Equivalence Code
LCC8,.06SQ,20
Package Shape
RECTANGULAR
Package Style
CHIP CARRIER, VERY THIN PROFILE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
13.1 ns
Qualification Status
Not Qualified
Schmitt Trigger
YES
Seated Height-Max
0.5 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
BUTT
Terminal Pitch
0.5 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
0.95 mm
Base Number Matches
2
3
Compare 74LVC3G17GM,125 with alternatives