74LVC3G17GM,125
vs
74LVC3G17GM
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NEXPERIA
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
QFN
|
|
| Package Description |
1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, XQFN-8
|
,
|
| Pin Count |
8
|
|
| Manufacturer Package Code |
SOT902-2
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Nexperia
|
|
| Family |
LVC/LCX/Z
|
|
| JESD-30 Code |
R-PBCC-B8
|
|
| JESD-609 Code |
e4
|
|
| Length |
1.95 mm
|
|
| Logic IC Type |
BUFFER
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
3
|
|
| Number of Inputs |
1
|
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
VBCC
|
|
| Package Equivalence Code |
LCC8,.06SQ,20
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
13.1 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.5 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
BUTT
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
0.95 mm
|
|
| Base Number Matches |
2
|
3
|
|
|
|
Compare 74LVC3G17GM,125 with alternatives