74ACT158CW
vs
5962R9654901QEA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
AEROFLEX COLORADO SPRINGS
Part Package Code
WAFER
DIP
Package Description
WAFER
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
ACT
ACT
JESD-30 Code
X-XUUC-N16
R-CDIP-T16
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
1
Number of Inputs
2
8
Number of Outputs
1
1
Number of Terminals
16
16
Output Polarity
INVERTED
COMPLEMENTARY
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIE
DIP
Package Equivalence Code
DIE OR CHIP
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
IN-LINE
Propagation Delay (tpd)
9 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
UPPER
DUAL
Base Number Matches
1
1
Pin Count
16
JESD-609 Code
e0
Length
19.05 mm
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Seated Height-Max
5.08 mm
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Total Dose
100k Rad(Si) V
Width
7.62 mm
Compare 74ACT158CW with alternatives
Compare 5962R9654901QEA with alternatives