5962-8873301ZX
vs
IDT7210L55FB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
PGA
QFP
Package Description
PGA,
QFP-64
Pin Count
68
64
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT
Boundary Scan
NO
NO
External Data Bus Width
16
16
JESD-30 Code
S-XPGA-P68
S-PQFP-F64
Low Power Mode
NO
YES
Number of Terminals
68
64
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Data Bus Width
35
19
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
PGA
QFF
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
38535Q/M;38534H;883B
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
PIN/PEG
FLAT
Terminal Position
PERPENDICULAR
QUAD
uPs/uCs/Peripheral ICs Type
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
Base Number Matches
3
1
Rohs Code
Clock Frequency-Max
18.18 MHz
JESD-609 Code
e0
Length
22.86 mm
Package Equivalence Code
QFL64,.9SQ
Seated Height-Max
2.286 mm
Supply Current-Max
110 mA
Terminal Finish
TIN LEAD
Terminal Pitch
1.27 mm
Width
22.86 mm
Compare 5962-8873301ZX with alternatives
Compare IDT7210L55FB with alternatives