IDT7210L55FB
vs
IDT7210L65P
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
DIP
Package Description
QFP-64
0.900 INCH, PLASTIC, DIP-64
Pin Count
64
64
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Boundary Scan
NO
NO
Clock Frequency-Max
18.18 MHz
External Data Bus Width
16
16
JESD-30 Code
S-PQFP-F64
R-PDIP-T64
JESD-609 Code
e0
e0
Length
22.86 mm
81.534 mm
Low Power Mode
YES
YES
Number of Terminals
64
64
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Output Data Bus Width
19
35
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFF
DIP
Package Equivalence Code
QFL64,.9SQ
DIP64,.9
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
2.286 mm
5.842 mm
Supply Current-Max
110 mA
122.31 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
FLAT
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Width
22.86 mm
22.86 mm
uPs/uCs/Peripheral ICs Type
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
30
Compare IDT7210L55FB with alternatives
Compare IDT7210L65P with alternatives