10174N
vs
MC10H158FNR2G
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
PHILIPS COMPONENTS
ONSEMI
Package Description
,
LEAD FREE, PLASTIC, LCC-20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
10K
10H
JESD-30 Code
R-PDIP-T16
S-PQCC-J20
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
2
4
Number of Inputs
4
2
Number of Outputs
1
1
Number of Terminals
16
20
Operating Temperature-Max
85 °C
75 °C
Operating Temperature-Min
-30 °C
Output Characteristics
OPEN-EMITTER
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
QCCJ
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Propagation Delay (tpd)
6.4 ns
1.9 ns
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
YES
Technology
ECL
ECL
Temperature Grade
OTHER
COMMERCIAL EXTENDED
Terminal Form
THROUGH-HOLE
J BEND
Terminal Position
DUAL
QUAD
Base Number Matches
1
1
Rohs Code
Part Package Code
QLCC
Pin Count
20
Factory Lead Time
4 Weeks
JESD-609 Code
e3
Length
8.965 mm
Package Equivalence Code
LDCC20,.4SQ
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
53 mA
Prop. Delay@Nom-Sup
2.9 ns
Seated Height-Max
4.57 mm
Terminal Finish
TIN
Terminal Pitch
1.27 mm
Width
8.965 mm
Compare 10174N with alternatives
Compare MC10H158FNR2G with alternatives