M4A3-256/128-7FAC vs M4A3-256/192-7FAC feature comparison

M4A3-256/128-7FAC Lattice Semiconductor Corporation

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M4A3-256/192-7FAC Lattice Semiconductor Corporation

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP LATTICE SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description FPBGA-256 FPBGA-256
Pin Count 256 256
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature YES YES
Clock Frequency-Max 76.9 MHz 76.9 MHz
In-System Programmable YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
JTAG BST YES YES
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs 14
Number of I/O Lines 128 192
Number of Macro Cells 256 256
Number of Terminals 256 256
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 14 DEDICATED INPUTS, 128 I/O 0 DEDICATED INPUTS, 192 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type EE PLD EE PLD
Propagation Delay 7.5 ns 7.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 2.1 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
Base Number Matches 1 1

Compare M4A3-256/128-7FAC with alternatives

Compare M4A3-256/192-7FAC with alternatives