M4A3-256/192-7FAC vs XCR3256XL-12PQ208Q feature comparison

M4A3-256/192-7FAC Lattice Semiconductor Corporation

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XCR3256XL-12PQ208Q AMD Xilinx

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP XILINX INC
Part Package Code BGA QFP
Package Description FPBGA-256 PLASTIC, QFP-208
Pin Count 256 208
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature YES YES
Clock Frequency-Max 76.9 MHz
In-System Programmable YES YES
JESD-30 Code S-PBGA-B256 S-PQFP-G208
JESD-609 Code e0 e0
JTAG BST YES YES
Length 17 mm 28 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 192 164
Number of Macro Cells 256 256
Number of Terminals 256 208
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 192 I/O 0 DEDICATED INPUTS, 164 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA FQFP
Package Equivalence Code BGA256,16X16,40 QFP208,1.2SQ,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type EE PLD EE PLD
Propagation Delay 7.5 ns 12 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 4.1 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL AUTOMOTIVE
Terminal Finish TIN LEAD Tin/Lead (Sn85Pb15)
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.5 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 28 mm
Base Number Matches 1 1

Compare M4A3-256/192-7FAC with alternatives

Compare XCR3256XL-12PQ208Q with alternatives