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Parametric » Telecommunication Circuits » Cordless Telephone ICs

Parametric results for: ML2722 under Cordless Telephone ICs

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Select Parts		Part Number

		ML2722EH RF Micro Devices Inc
		ML2722DH-T RF Micro Devices Inc
		ML2722DH RF Micro Devices Inc
		ML2722DH Sony Semiconductor

				Most Relevant		Technical				Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Technology	Telecom IC Type	Number of Functions	Supply Current-Max	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code	ECCN Code

Check for Price

Obsolete

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

1

COMMERCIAL EXTENDED

S-PQFP-G32

Not Qualified

80 °C

-30 °C

32

PLASTIC/EPOXY

TQFP

SQUARE

FLATPACK, THIN PROFILE

YES

GULL WING

800 µm

QUAD

7 mm

7 mm

1.2 mm

MICRO LINEAR CORP

QFP

TQFP,

32

unknown

8542.39.00.01

Check for Price

Transferred

3.3 V

BICMOS

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

1

63.5 mA

COMMERCIAL

S-PQFP-G32

Not Qualified

60 °C

-10 °C

32

PLASTIC/EPOXY

TQFP

SQUARE

FLATPACK, THIN PROFILE

YES

GULL WING

800 µm

QUAD

7 mm

7 mm

1.2 mm

MICRO LINEAR CORP

QFP

TQFP,

32

unknown

8517.70.00.00

5A991.G

Check for Price

Transferred

3.3 V

BICMOS

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

1

63.5 mA

COMMERCIAL

S-PQFP-G32

e3

Not Qualified

60 °C

-10 °C

32

PLASTIC/EPOXY

TQFP

TQFP32,.35SQ,32

SQUARE

FLATPACK, THIN PROFILE

YES

MATTE TIN

GULL WING

800 µm

QUAD

7 mm

7 mm

1.2 mm

SIRENZA MICRODEVICES INC

QFP

TQFP, TQFP32,.35SQ,32

32

unknown

8542.39.00.01

Check for Price

Yes

Yes

Obsolete

3 V

BICMOS

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

1

63.5 mA

OTHER

R-PDSO-N26

e6/e4

Not Qualified

85 °C

-35 °C

260

10

26

PLASTIC/EPOXY

HVSSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

YES

TIN BISMUTH/PALLADIUM

NO LEAD

400 µm

DUAL

4.4 mm

5.6 mm

1 mm

SONY CORP

SOF

HVSSON,

26

unknown

8542.39.00.01

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Telecommunication Circuits

RF Micro Devices Inc

Check for Price

Obsolete

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

1

COMMERCIAL EXTENDED

S-PQFP-G32

Not Qualified

80 °C

-30 °C

32

PLASTIC/EPOXY

TQFP

SQUARE

FLATPACK, THIN PROFILE

YES

GULL WING

800 µm

QUAD

7 mm

7 mm

1.2 mm

MICRO LINEAR CORP

QFP

TQFP,

32

unknown

8542.39.00.01

Telecommunication Circuits

RF Micro Devices Inc

Check for Price

Transferred

3.3 V

BICMOS

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

1

63.5 mA

COMMERCIAL

S-PQFP-G32

Not Qualified

60 °C

-10 °C

32

PLASTIC/EPOXY

TQFP

SQUARE

FLATPACK, THIN PROFILE

YES

GULL WING

800 µm

QUAD

7 mm

7 mm

1.2 mm

MICRO LINEAR CORP

QFP

TQFP,

32

unknown

8517.70.00.00

5A991.G

Telecommunication Circuits

RF Micro Devices Inc

Check for Price

Transferred

3.3 V

BICMOS

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

1

63.5 mA

COMMERCIAL

S-PQFP-G32

e3

Not Qualified

60 °C

-10 °C

32

PLASTIC/EPOXY

TQFP

TQFP32,.35SQ,32

SQUARE

FLATPACK, THIN PROFILE

YES

MATTE TIN

GULL WING

800 µm

QUAD

7 mm

7 mm

1.2 mm

SIRENZA MICRODEVICES INC

QFP

TQFP, TQFP32,.35SQ,32

32

unknown

8542.39.00.01

Telecommunication Circuits

Sony Semiconductor

Check for Price

Yes

Yes

Obsolete

3 V

BICMOS

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

1

63.5 mA

OTHER

R-PDSO-N26

e6/e4

Not Qualified

85 °C

-35 °C

260

10

26

PLASTIC/EPOXY

HVSSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

YES

TIN BISMUTH/PALLADIUM

NO LEAD

400 µm

DUAL

4.4 mm

5.6 mm

1 mm

SONY CORP

SOF

HVSSON,

26

unknown

8542.39.00.01