Datasheets
ML2722DH by:

Support Circuit, PDSO26, PLASTIC, HSOF-26

Part Details for ML2722DH by Sony Semiconductor

Overview of ML2722DH by Sony Semiconductor

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Part Details for ML2722DH

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ML2722DH Part Data Attributes

ML2722DH Sony Semiconductor
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ML2722DH Sony Semiconductor Support Circuit, PDSO26, PLASTIC, HSOF-26
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SONY CORP
Part Package Code SOF
Package Description HVSSON,
Pin Count 26
Reach Compliance Code unknown
HTS Code 8542.39.00.01
JESD-30 Code R-PDSO-N26
JESD-609 Code e6/e4
Length 5.6 mm
Number of Functions 1
Number of Terminals 26
Operating Temperature-Max 85 °C
Operating Temperature-Min -35 °C
Package Body Material PLASTIC/EPOXY
Package Code HVSSON
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1 mm
Supply Current-Max 63.5 mA
Supply Voltage-Nom 3 V
Surface Mount YES
Technology BICMOS
Telecom IC Type CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Temperature Grade OTHER
Terminal Finish TIN BISMUTH/PALLADIUM
Terminal Form NO LEAD
Terminal Pitch 0.4 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 10
Width 4.4 mm

Alternate Parts for ML2722DH

This table gives cross-reference parts and alternative options found for ML2722DH. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of ML2722DH, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CXG1051AFN Support Circuit, PDSO26, PLASTIC, HSOF-26 Sony Semiconductor ML2722DH vs CXG1051AFN
CXG1096FN Support Circuit, PDSO26, PLASTIC, HSOF-26 Sony Semiconductor ML2722DH vs CXG1096FN

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