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Parametric results for: ML2722 under Cordless Telephone ICs

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Z87L0116ASG
 Zilog Inc 		$32.2483 Yes Transferred 3.3 V CMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 COMMERCIAL S-PQFP-G144 Not Qualified 70 °C -20 °C NOT SPECIFIED NOT SPECIFIED 144 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 20 mm 20 mm 1.6 mm ZILOG INC QFP LFQFP, 144 unknown 8542.39.00.01 Cordless Telephone Support Circuit
TB31262F
 Toshiba America Electronic Components 		Check for Price No No Active 3.6 V BICMOS CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 84 mA COMMERCIAL S-PQFP-G52 Not Qualified 70 °C -20 °C NOT SPECIFIED NOT SPECIFIED 52 PLASTIC/EPOXY QFP SQUARE FLATPACK YES GULL WING 650 µm QUAD 10 mm 10 mm 2.45 mm TOSHIBA CORP QFP QFP, 52 unknown 8542.39.00.01
UPC8002GR-E1
 NEC Electronics Group 		Check for Price No Obsolete 3 V BIPOLAR CORDLESS TELEPHONE SUPPORT CIRCUIT 1 2.2 mA OTHER R-PDSO-G20 e0 Not Qualified 85 °C -30 °C 20 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 4.4 mm 1.45 mm NEC ELECTRONICS CORP SSOP LSSOP, 20 compliant 8542.39.00.01
MC13110AFB
 Motorola Semiconductor Products 		Check for Price No Obsolete 3.6 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 10.5 mA INDUSTRIAL S-PQFP-G52 e0 Not Qualified 85 °C -40 °C 52 PLASTIC/EPOXY QFP QFP52,.52SQ SQUARE FLATPACK YES TIN LEAD GULL WING 650 µm QUAD 10 mm 10 mm 2.45 mm MOTOROLA INC QFP, QFP52,.52SQ unknown 8542.39.00.01
UBA1706TS
 NXP Semiconductors 		Check for Price Obsolete 3.3 V BICMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 3.2 µA COMMERCIAL EXTENDED R-PDSO-G24 e4 Not Qualified 75 °C -25 °C 24 PLASTIC/EPOXY SSOP SSOP24,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES NICKEL PALLADIUM GOLD GULL WING 650 µm DUAL 5.3 mm 8.2 mm 2 mm NXP SEMICONDUCTORS SSOP SSOP, SSOP24,.3 24 compliant 8542.39.00.01
TA31136FG
 Toshiba America Electronic Components 		Check for Price Active 2 V BIPOLAR CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 4.6 mA OTHER R-PDSO-G16 e2 Not Qualified 85 °C -30 °C 16 PLASTIC/EPOXY SSOP SOP16,.25,40 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES TIN SILVER GULL WING 1 mm DUAL 4.6 mm 8.2 mm 1.9 mm TOSHIBA CORP SOIC SSOP, SOP16,.25,40 16 unknown 8542.39.00.01
MSM6870-3GS-VK
 OKI Electric Industry Co Ltd 		Check for Price Obsolete 3.6 V CORDLESS TELEPHONE SUPPORT CIRCUIT 1 13 mA OTHER R-PDSO-G32 Not Qualified 70 °C -30 °C 32 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 1 mm DUAL 7.9 mm 16 mm 2.5 mm OKI ELECTRIC INDUSTRY CO LTD SSOP SSOP, 32 unknown 8542.39.00.01
HPMX-5002-TY1
 Avago Technologies 		Check for Price Obsolete 3 V CORDLESS TELEPHONE BASEBAND CIRCUIT 1 27 mA S-PQFP-G48 Not Qualified 48 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 7 mm 7 mm 1.6 mm AVAGO TECHNOLOGIES INC QFP LFQFP, 48 unknown 8542.39.00.01
SC14402DVJG
 Texas Instruments 		Check for Price No Obsolete 3 V CMOS CORDLESS TELEPHONE BASEBAND CIRCUIT 1 S-PQFP-G100 e0 Not Qualified 100 PLASTIC/EPOXY LFQFP QFP100,.63SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES TIN LEAD GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm NATIONAL SEMICONDUCTOR CORP LFQFP, QFP100,.63SQ,20 unknown 8542.39.00.01
PCD5041H
 Philips Semiconductors 		Check for Price No Transferred CMOS 12 mA OTHER R-PQFP-G64 e0 Not Qualified 70 °C -25 °C 64 PLASTIC/EPOXY QFP QFP64,.7X.95,40 RECTANGULAR FLATPACK YES Tin/Lead (Sn/Pb) GULL WING 1 mm QUAD PHILIPS SEMICONDUCTORS QFP, QFP64,.7X.95,40 unknown 8542.39.00.01
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