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31 - 40 of 4,164 results
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TS2418CDC3
Taiwan Semiconductor
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Check for Price | Yes | Obsolete | 26 V | TELEPHONE RINGER CIRCUIT | 1 | 1.8 µA | OTHER | R-PDIP-T8 | Not Qualified | 70 °C | -20 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 9.195 mm | TAIWAN SEMICONDUCTOR CO LTD | DIP, DIP8,.3 | compliant | 8542.39.00.01 | |||||||||||
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L3240D1
STMicroelectronics
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Check for Price | No | Obsolete | 26 V | BIPOLAR | TELEPHONE RINGER CIRCUIT | 1 | COMMERCIAL | R-PDSO-G8 | e0 | Not Qualified | 70 °C | -20 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | STMICROELECTRONICS | SOP, SOP8,.25 | not_compliant | 8542.39.00.01 | SOIC | 8 | ||||||||
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L3240B
STMicroelectronics
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Check for Price | No | Obsolete | 26 V | BIPOLAR | COMMERCIAL | R-PDIP-T8 | e0 | Not Qualified | 70 °C | -20 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | STMICROELECTRONICS | DIP-8 | unknown | 8542.39.00.01 | |||||||||||||||
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LS1240
STMicroelectronics
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Check for Price | No | Obsolete | 26 V | TELEPHONE RINGER CIRCUIT | 1 | COMMERCIAL | R-PDIP-T8 | e0 | Not Qualified | 70 °C | -20 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 5.08 mm | STMICROELECTRONICS | MINI, DIP-8 | not_compliant | 8542.39.00.01 | DIP | 8 | ||||||||||
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E-LS1240A
STMicroelectronics
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Check for Price | Yes | Obsolete | 26 V | TELEPHONE RINGER CIRCUIT | 1 | OTHER | R-PDIP-T8 | Not Qualified | 70 °C | -40 °C | 250 | 40 | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 5.08 mm | STMICROELECTRONICS | DIP, DIP8,.3 | unknown | 8542.39.00.01 | DIP | 8 | STMicroelectronics | |||||||||
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KA2428B
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 26 V | BIPOLAR | TELEPHONE RINGER CIRCUIT | 1 | 1.8 µA | COMMERCIAL | R-PDIP-T8 | e0 | Not Qualified | 70 °C | -20 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 9.2 mm | 5.08 mm | SAMSUNG SEMICONDUCTOR INC | DIP, DIP8,.3 | compliant | 8542.39.00.01 | DIP | 8 | ||||||
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E-LS1240AD1
STMicroelectronics
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Check for Price | Yes | Obsolete | 26 V | TELEPHONE RINGER CIRCUIT | 1 | OTHER | R-PDSO-G8 | e4 | Not Qualified | 1 | 70 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | STMICROELECTRONICS | SOP, SOP8,.25 | compliant | 8542.39.00.01 | SOIC | 8 | STMicroelectronics | |||||||
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BL1240
Shanghai Belling Co Ltd
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Check for Price | Contact Manufacturer | 26 V | 1.8 mA | COMMERCIAL | R-PDIP-T8 | Not Qualified | 70 °C | -20 °C | 8 | PLASTIC/EPOXY | DIP | DIP8(UNSPEC) | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | SHANGHAI BELLING CO LTD | DIP, DIP8(UNSPEC) | unknown | 8542.39.00.01 | |||||||||||||||||||
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KA2428N
Samsung Semiconductor
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Check for Price | No | Obsolete | 26 V | BIPOLAR | 1.8 mA | COMMERCIAL | R-PDIP-T8 | e0 | Not Qualified | 70 °C | -20 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | SAMSUNG SEMICONDUCTOR INC | DIP, DIP8,.3 | compliant | 8542.39.00.01 | ||||||||||||||
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LS1240A
STMicroelectronics
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Check for Price | Yes | Obsolete | 26 V | TELEPHONE RINGER CIRCUIT | 1 | OTHER | R-PDIP-T8 | e3 | Not Qualified | 70 °C | -40 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 9.652 mm | 5.08 mm | STMICROELECTRONICS | DIP, DIP8,.3 | compliant | 8542.39.00.01 | DIP | 8 | STMicroelectronics |