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BGS12SN6E6327XTSA1
 Infineon Technologies AG 		$0.1316 Yes Obsolete 2.6 V TELECOM CIRCUIT 1 OTHER R-XBCC-B6 e3 1 85 °C -30 °C NOT SPECIFIED NOT SPECIFIED 6 UNSPECIFIED BCC RECTANGULAR CHIP CARRIER YES Tin (Sn) BUTT 400 µm BOTTOM 700 µm 1.1 mm 400 µm INFINEON TECHNOLOGIES AG 1.10 X 0.70 MM, 0.31 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, TSNP-6 compliant Infineon
AP22802AW5-7
 Diodes Incorporated 		$0.1325 Yes Not Recommended 5 V 1 LOAD SWITCH 1 R-PDSO-G5 1 85 °C -40 °C 260 30 5 PLASTIC/EPOXY LSSOP TSOP5/6,.11,37 RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.6 mm 3 mm 1.4 mm DIODES INC SOT-25, 5 PIN compliant Diodes Incorporated EAR99 8542.39.00.01 NO 5.5 V 2.7 V
AP22802BW5-7
 Diodes Incorporated 		$0.1554 Yes Not Recommended 5 V 1 LOAD SWITCH 1 R-PDSO-G5 85 °C -40 °C 260 5 PLASTIC/EPOXY LSSOP TSOP5/6,.11,37 RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.6 mm 3 mm 1.4 mm DIODES INC SOT-25, 5 PIN compliant Diodes Incorporated EAR99 8542.39.00.01 NO 5.5 V 2.7 V
AP22814ASN-7
 Diodes Incorporated 		$0.1659 Yes Yes Active 5 V TELECOM CIRCUIT 1 INDUSTRIAL S-PDSO-N6 e4 85 °C -40 °C 260 30 6 PLASTIC/EPOXY HVSON SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 650 µm DUAL 2 mm 2 mm 630 µm DIODES INC UDFN-6 compliant Diodes Incorporated EAR99 8542.39.00.01
AP22814BSN-7
 Diodes Incorporated 		$0.1683 Yes Active 5 V TELECOM CIRCUIT 1 INDUSTRIAL S-PDSO-N6 e4 85 °C -40 °C 260 30 6 PLASTIC/EPOXY HVSON SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 650 µm DUAL 2 mm 2 mm 630 µm DIODES INC UDFN-6 compliant Diodes Incorporated EAR99 8542.39.00.01
AP22800HB-7
 Diodes Incorporated 		$0.1719 Yes Active 5 V TELECOM CIRCUIT 1 INDUSTRIAL R-PDSO-N8 e4 85 °C -40 °C 260 8 PLASTIC/EPOXY HVSON RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 500 µm DUAL 1.6 mm 2.1 mm 605 µm DIODES INC 2.10 X 1.60 MM, GREEN, DFN-8 compliant Diodes Incorporated EAR99 8542.39.00.01
HTMS8001FTB/AF,115
 NXP Semiconductors 		$0.1822 Yes Active CMOS TELECOM CIRCUIT Not Qualified 1 260 NOT SPECIFIED 3 PLASTIC/EPOXY QCCN LCC3(UNSPEC) CHIP CARRIER YES NO LEAD QUAD NXP SEMICONDUCTORS compliant NXP SON 3 SOT1122
AP22811AM8-13
 Diodes Incorporated 		$0.1866 Yes Not Recommended 5 V TELECOM CIRCUIT 1 INDUSTRIAL R-PDSO-G8 e3 85 °C -40 °C 260 30 8 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 2.95 mm 3 mm 1.1 mm DIODES INC MSOP-8 compliant Diodes Incorporated EAR99 8542.39.00.01
AP22804AM8-13
 Diodes Incorporated 		$0.2051 Yes Active 5 V TELECOM CIRCUIT 1 S-PDSO-G8 e3 85 °C -40 °C 260 30 8 PLASTIC/EPOXY TSSOP TSSOP8,.19 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 3 mm 3 mm 1.1 mm DIODES INC , compliant Diodes Incorporated EAR99 8542.39.00.01
AP22804AW5-7
 Diodes Incorporated 		$0.2075 Yes Yes Active 5 V TELECOM CIRCUIT 1 INDUSTRIAL R-PDSO-G5 e3 85 °C -40 °C 260 30 5 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.6 mm 3 mm 1.4 mm DIODES INC SOT-25,5 PIN compliant Diodes Incorporated EAR99 8542.39.00.01
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