Filter Your Search
41 - 50 of 45,137 results
|
CMX971Q7
CML Microcircuits Plc
|
Check for Price | Yes | Active | 3.3 V | TELECOM CIRCUIT | 1 | 75 µA | INDUSTRIAL | S-PQCC-N16 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 650 µm | QUAD | 4 mm | 4 mm | 1 mm | CML MICROCIRCUITS LTD | QFN | HVQCCN, LCC16,.16SQ,25 | 16 | compliant | 8542.39.00.01 | |||||||||||
|
RFFC5061SR
RF Micro Devices Inc
|
Check for Price | Transferred | 3 V | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N32 | 85 °C | -40 °C | 32 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 950 µm | RF MICRO DEVICES INC | HVQCCN, | unknown | 8542.39.00.01 | ||||||||||||||||
|
RF2051
RF Micro Devices Inc
|
Check for Price | Yes | Yes | Transferred | 3 V | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N32 | e3 | Not Qualified | 2 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) - annealed | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 1 mm | RF MICRO DEVICES INC | QFN | 5 X 5 MM, GREEN, PLASTIC, QFN-32 | 32 | unknown | 8517.70.00.00 | 5A991.G | ||||
|
T0980-TJ
Temic Semiconductors
|
Check for Price | Transferred | 3.6 V | TELECOM CIRCUIT | 1 | R-PDSO-G16 | Not Qualified | 16 | PLASTIC/EPOXY | HLSSOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 635 µm | DUAL | 3.95 mm | 4.9 mm | 1.6 mm | TEMIC SEMICONDUCTORS | PLASTIC, SSOP-16 | unknown | ||||||||||||||||||||
|
GXB1000-5WSC
Sony Semiconductor
|
Check for Price | Obsolete | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XXMA-X | Not Qualified | 85 °C | -40 °C | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | UNSPECIFIED | UNSPECIFIED | SONY CORP | , | unknown | 8542.39.00.01 | ||||||||||||||||||||||
|
RF6545TR13
RF Micro Devices Inc
|
Check for Price | Yes | Transferred | 3.3 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N20 | Not Qualified | 85 °C | -40 °C | 20 | UNSPECIFIED | HVQCCN | LCC20,.14SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 3.5 mm | 3.5 mm | 500 µm | RF MICRO DEVICES INC | QFN | HVQCCN, LCC20,.14SQ,20 | 20 | unknown | 8517.70.00.00 | 5A991.G | |||||||||||
|
SL2150F/KG/LH3S
Microsemi Corporation
|
Check for Price | No | Transferred | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N28 | e0 | Not Qualified | 85 °C | -40 °C | 28 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 1 mm | ZARLINK SEMICONDUCTOR INC | QFN | HVQCCN, | 28 | unknown | 8542.39.00.01 | |||||||||||
|
RFFC5071ASB
Qorvo
|
Check for Price | Yes | Active | 3 V | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N32 | e4 | 2 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 32 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 950 µm | QORVO INC | QFN-32 | compliant | 8517.70.00.00 | 5A991.G | |||||||||
|
SI5383A-D10254-GMR
Skyworks Solutions Inc
|
Check for Price | Yes | Active | 1.8 V | TELECOM CIRCUIT | Also Require 3.3V Supply | 1 | S-XBGA-N56 | e4 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | UNSPECIFIED | VFLGA | LGA56,14X14,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | NICKEL GOLD | NO LEAD | 500 µm | BOTTOM | 8 mm | 8 mm | 1 mm | SKYWORKS SOLUTIONS INC | LGA-56 | unknown | |||||||||||
|
AM95C71-16LC
AMD
|
Check for Price | No | Obsolete | TELECOM CIRCUIT | 1 | COMMERCIAL | S-CQCC-N68 | e0 | Not Qualified | 70 °C | 68 | CERAMIC, METAL-SEALED COFIRED | QCCN | SQUARE | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 24.13 mm | 24.13 mm | 3.048 mm | ADVANCED MICRO DEVICES INC | LCC | QCCN, | 68 | unknown | 8542.39.00.01 |