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BGSA143ML10E6327XTSA1
Infineon Technologies AG
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$0.3895 | Yes | Active | TELECOM CIRCUIT | 1 | NOT SPECIFIED | NOT SPECIFIED | INFINEON TECHNOLOGIES AG | compliant | 8542.39.00.01 | Infineon | |||||||||||||||||||||||||||||||||||||||||||
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BGS13PN10E6327XTSA1
Infineon Technologies AG
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$0.3975 | Yes | Yes | Obsolete | 2.85 V | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XBCC-B10 | e3 | 1 | 85 °C | -40 °C | 10 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | TIN | BUTT | 400 µm | BOTTOM | 1.1 mm | 1.5 mm | 400 µm | INFINEON TECHNOLOGIES AG | compliant | 8542.39.00.01 | Infineon | TSNP-10 | ||||||||||||||||||||||
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BGA5M1BN6E6327XTSA1
Infineon Technologies AG
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$0.4012 | Yes | Obsolete | 1.8 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XBCC-B6 | 1 | 85 °C | -40 °C | 6 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | 400 µm | BOTTOM | 700 µm | 1.1 mm | 400 µm | INFINEON TECHNOLOGIES AG | compliant | 8542.39.00.01 | Infineon | BCC, | 2018-04-13 | |||||||||||||||||||||||||
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BGA123L4E6327XTSA1
Infineon Technologies AG
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$0.4032 | Yes | Active | 1.8 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XBCC-N4 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 4 | UNSPECIFIED | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | YES | NO LEAD | 400 µm | BOTTOM | 700 µm | 700 µm | 320 µm | INFINEON TECHNOLOGIES AG | compliant | 8542.39.00.01 | Infineon | VQCCN, | ||||||||||||||||||||||||
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ATA8405C-6DQY-66
Microchip Technology Inc
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$0.4045 | Yes | Yes | Active | 3 V | TELECOM CIRCUIT | 1 | COMMERCIAL | S-PDSO-G10 | e3 | 2 | 50 °C | 260 | 40 | 10 | PLASTIC/EPOXY | TSSOP | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | MICROCHIP TECHNOLOGY INC | compliant | Microchip | LEAD FREE, MO-187, TSSOP-10 | |||||||||||||||||||||||
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ATA8404C-6DQY-66
Microchip Technology Inc
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$0.4045 | Yes | Yes | Active | 3 V | TELECOM CIRCUIT | 1 | COMMERCIAL | S-PDSO-G10 | e3 | 2 | 50 °C | 260 | 40 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | MICROCHIP TECHNOLOGY INC | compliant | Microchip | LEAD FREE, MO-187, TSSOP-10 | ||||||||||||||||||||||
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AP2280-1WG-7
Diodes Incorporated
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$0.4089 | Yes | Yes | Active | 1.8 V | 1 | POWER SUPPLY SUPPORT CIRCUIT | 1 | R-PDSO-G5 | 3 | 85 °C | -40 °C | 260 | 30 | 5 | PLASTIC/EPOXY | LSSOP | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.6 mm | 3 mm | 1.45 mm | DIODES INC | compliant | 8542.39.00.01 | SOT-25, 5 PIN | SOT | 5 | EAR99 | NO | 6 V | 1.5 V | ||||||||||||||||
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AT88SC6416CRF-MR1
Microchip Technology Inc
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$0.4219 | Yes | Obsolete | CMOS | SYNCHRONOUS | 1 | R-XUUC-N2 | e4 | 70 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | YES | Silver (Ag) | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | compliant | 8523.52.00.90 | Microchip | GREEN PACKAGE-2 | 5A992.C | 65.536 kbit | CRYPTORF MEMORY | 8 | 8.192 k | 8000 | 8KX8 | |||||||||||||||||||||||
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LXMS21ACMF-183
Murata Manufacturing Co Ltd
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$0.4232 | Yes | Obsolete | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XBCC-B2 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 2 | UNSPECIFIED | VBCC | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | YES | BUTT | BOTTOM | 1.2 mm | 2 mm | 500 µm | MURATA MANUFACTURING CO LTD | compliant | 8542.39.00.01 | Murata Electronics | VBCC, | |||||||||||||||||||||||||||
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BGS12AL74E6327XTSA1
Infineon Technologies AG
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$0.4348 | Yes | Obsolete | 2.8 V | TELECOM CIRCUIT | 1 | OTHER | R-XBCC-B6 | e4 | 1 | 85 °C | -30 °C | 6 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | GOLD | BUTT | 550 µm | BOTTOM | 1.5 mm | 2.3 mm | 500 µm | INFINEON TECHNOLOGIES AG | compliant | 8542.39.00.01 | Infineon | HALOGEN FREE AND ROHS COMPLIANT, TSLP-7/6 |