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ATA5757C-6DQY-66
Microchip Technology Inc
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$0.2883 | Yes | Yes | Obsolete | 3 V | TELECOM CIRCUIT | 1 | AUTOMOTIVE | R-PDSO-G10 | 125 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 10 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | MICROCHIP TECHNOLOGY INC | TSSOP-10 | compliant | EAR99 | 8542.39.00.01 | Microchip | ||||||||||||||||||||||||
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ATA5756C-6DQY-66
Microchip Technology Inc
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$0.2883 | Yes | Yes | Obsolete | 3 V | TELECOM CIRCUIT | 1 | AUTOMOTIVE | S-PDSO-G10 | 125 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 10 | PLASTIC/EPOXY | TSSOP | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | MICROCHIP TECHNOLOGY INC | TSSOP-10 | compliant | EAR99 | 8542.39.00.01 | Microchip | ||||||||||||||||||||||||
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AP2280-2FMG-7
Diodes Incorporated
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$0.2962 | Yes | Yes | Active | 1.8 V | 1 | POWER SUPPLY SUPPORT CIRCUIT | 1 | R-PDSO-N6 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | SOLCC6,.07,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 1.8125 mm | 2.0125 mm | 605 µm | DIODES INC | DFN-6 | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated | DFN | 6 | NO | 6 V | 1.5 V | ||||||||||||||||
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AP22804ASN-7
Diodes Incorporated
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$0.2991 | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PDSO-N6 | e4 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 650 µm | DUAL | 2 mm | 2 mm | 630 µm | DIODES INC | UDFN-6 | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated | |||||||||||||||||||||||
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AP22814AW5-7
Diodes Incorporated
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$0.3082 | Yes | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G5 | e3 | 85 °C | -40 °C | 260 | 30 | 5 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.6 mm | 3 mm | 1.4 mm | DIODES INC | SOT-25,5 PIN | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated | ||||||||||||||||||||||
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AT88SC0808CRF-MVA1
Microchip Technology Inc
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$0.3126 | Yes | Not Recommended | CMOS | SYNCHRONOUS | 1 | OTHER | e4 | 70 °C | -25 °C | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Nickel/Gold (Ni/Au) | MICROCHIP TECHNOLOGY INC | compliant | 5A992.C | 8523.52.00.90 | 8.192 kbit | CRYPTO MEMORY | 8 | 1 | 1.024 k | 1000 | 1KX8 | ||||||||||||||||||||||||||||||
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ATR4253C-PVQW-1
Microchip Technology Inc
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$0.3155 | Yes | Active | 10 V | BICMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N16 | 115 °C | -40 °C | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 900 µm | MICROCHIP TECHNOLOGY INC | 3 X 3 MM, VQFN-16 | compliant | ||||||||||||||||||||||||||||
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BGS13SN8E6327XTSA1
Infineon Technologies AG
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$0.3164 | Yes | Yes | Active | MOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XBCC-B8 | e3 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | UNSPECIFIED | BCC | SQUARE | CHIP CARRIER | YES | Tin (Sn) | BUTT | 400 µm | BOTTOM | 1.1 mm | 1.1 mm | 400 µm | INFINEON TECHNOLOGIES AG | BCC, | compliant | 8542.39.00.01 | Infineon | ||||||||||||||||||||||
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AP22814BM8-13
Diodes Incorporated
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$0.3167 | Yes | Active | TELECOM CIRCUIT | e3 | 260 | 30 | MATTE TIN | DIODES INC | , | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated | |||||||||||||||||||||||||||||||||||||||||
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SL2S5002FTB,115
NXP Semiconductors
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$0.3211 | Yes | Active | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-N3 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 3 | PLASTIC/EPOXY | VSON | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | Tin (Sn) | NO LEAD | 550 µm | DUAL | 1 mm | 1.45 mm | 500 µm | NXP SEMICONDUCTORS | 1.45 X 1 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT1122, XSON-3 | compliant | NXP | SON | 3 | SOT1122 |