Parametric results for: MAX2202EWT under Cellular Telephone Circuits

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BALF-NRG-02D3
STMicroelectronics
$0.0782 Yes Active RF AND BASEBAND CIRCUIT 1 R-PBGA-B4 e1 105 °C -40 °C 260 30 4 PLASTIC/EPOXY VBGA BGA4,2X2,40/16 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 855 µm 1.385 mm 690 µm STMICROELECTRONICS CSPG-4 compliant STMicroelectronics
BGU7258X
NXP Semiconductors
$0.3474 Yes Not Recommended 3.3 V RF AND BASEBAND CIRCUIT 1 S-PDSO-N6 e4 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY HVSON SOLCC6,.06,20 SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD 500 µm DUAL 1.6 mm 1.6 mm 500 µm NXP SEMICONDUCTORS XSON-6 compliant NXP DFN 6 SOT1189-1 8542.33.00.01
BGS8L2X
NXP Semiconductors
$0.3475 Yes Not Recommended RF FRONT END CIRCUIT 1 260 NXP SEMICONDUCTORS compliant NXP SON 6 SOT1232 8542.33.00.01
BGC100GN6E6327XTSA1
Infineon Technologies AG
$0.4082 Yes Active CMOS RF AND BASEBAND CIRCUIT 1 R-XBCC-B6 1 6 UNSPECIFIED BCC RECTANGULAR CHIP CARRIER YES BUTT BOTTOM INFINEON TECHNOLOGIES AG BCC, compliant Infineon 8542.39.00.01
BGA7H1BN6E6327XTSA1
Infineon Technologies AG
$0.4900 Yes Active 2.8 V RF AND BASEBAND CIRCUIT 1 INDUSTRIAL R-PBCC-N6 e3 1 85 °C -40 °C 6 PLASTIC/EPOXY VQCCN RECTANGULAR CHIP CARRIER, VERY THIN PROFILE YES Tin (Sn) NO LEAD 400 µm BOTTOM 700 µm 1.1 mm 400 µm INFINEON TECHNOLOGIES AG VQCCN, compliant Infineon 8542.39.00.01
BGA7L1BN6E6327XTSA1
Infineon Technologies AG
$0.4902 Yes Active 2.8 V RF AND BASEBAND CIRCUIT 1 INDUSTRIAL R-PBCC-N6 e3 1 85 °C -40 °C 6 PLASTIC/EPOXY VQCCN RECTANGULAR CHIP CARRIER, VERY THIN PROFILE YES Tin (Sn) NO LEAD 400 µm BOTTOM 700 µm 1.1 mm 400 µm INFINEON TECHNOLOGIES AG VQCCN, compliant Infineon 8542.39.00.01
MAX2608EUT+T
Maxim Integrated Products
$0.4936 Yes Yes Transferred 2.75 V BASEBAND CIRCUIT 1 INDUSTRIAL R-PDSO-G6 e3 Not Qualified 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.625 mm 2.9 mm 1.45 mm MAXIM INTEGRATED PRODUCTS INC LSSOP, compliant SOT-23 6 8542.39.00.01 EAR99
LMV225TLX/NOPB
Texas Instruments
$0.5564 Yes Yes Active 2.7 V 1 RF AND BASEBAND CIRCUIT 1 8 mA INDUSTRIAL S-PBGA-B4 e1 Not Qualified 1 85 °C -40 °C 260 30 4 PLASTIC/EPOXY VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 500 µm BOTTOM 1.014 mm 1.014 mm 675 µm TEXAS INSTRUMENTS INC SMD-4 compliant Texas Instruments DSBGA 4 8542.39.00.01 EAR99
LMV225URX/NOPB
Texas Instruments
$0.5564 Yes Yes Active 5 V 1 RF AND BASEBAND CIRCUIT 1 8 mA S-XBGA-B4 e1 1 260 30 4 UNSPECIFIED VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL BOTTOM TEXAS INSTRUMENTS INC compliant Texas Instruments 8542.39.00.01 EAR99
LTE3401HX
NXP Semiconductors
$0.5732 Yes End Of Life 1.8 V RF AND BASEBAND CIRCUIT 1 INDUSTRIAL R-PBCC-B6 1 85 °C -40 °C 260 6 PLASTIC/EPOXY BCC RECTANGULAR CHIP CARRIER YES BUTT 400 µm BOTTOM 700 µm 1.1 mm 400 µm NXP SEMICONDUCTORS BCC, compliant NXP 8542.33.00.01 2018-10-26