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Parametric » Telecommunication Circuits » Cellular Telephone Circuits

Parametric results for: MAX2202EWT under Cellular Telephone Circuits

Select parts from the table below to compare.

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Select Parts		Part Number

		MAX2202EWT+T10 Maxim Integrated Products
		MAX2202EWT+ Maxim Integrated Products
		MAX2202EWT+T Maxim Integrated Products

				Most Relevant		Technical			Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Technology	Telecom IC Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code

Check for Price

Yes

Obsolete

2.8 V

BICMOS

RF AND BASEBAND CIRCUIT

1

INDUSTRIAL

R-PBGA-B6

Not Qualified

85 °C

-40 °C

260

30

6

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

400 µm

BOTTOM

865 µm

1.27 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA,

6

compliant

8542.39.00.01

Check for Price

Yes

Yes

Obsolete

2.8 V

BICMOS

RF AND BASEBAND CIRCUIT

1

INDUSTRIAL

R-PBGA-B6

e2

1

85 °C

-40 °C

260

30

6

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

865 µm

1.27 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

ROHS COMPLIANT, WLP-6

compliant

8542.39.00.01

Check for Price

Yes

Yes

Obsolete

2.8 V

BICMOS

RF AND BASEBAND CIRCUIT

1

INDUSTRIAL

R-PBGA-B6

e2

1

85 °C

-40 °C

260

30

6

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

865 µm

1.27 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

ROHS COMPLIANT, WLP-6

compliant

8542.39.00.01

Compare

Telecommunication Circuits

Maxim Integrated Products

Check for Price

Yes

Obsolete

2.8 V

BICMOS

RF AND BASEBAND CIRCUIT

1

INDUSTRIAL

R-PBGA-B6

Not Qualified

85 °C

-40 °C

260

30

6

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

400 µm

BOTTOM

865 µm

1.27 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA,

6

compliant

8542.39.00.01

Maxim Integrated Products

Check for Price

Yes

Yes

Obsolete

2.8 V

BICMOS

RF AND BASEBAND CIRCUIT

1

INDUSTRIAL

R-PBGA-B6

e2

1

85 °C

-40 °C

260

30

6

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

865 µm

1.27 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

ROHS COMPLIANT, WLP-6

compliant

8542.39.00.01

Maxim Integrated Products

Check for Price

Yes

Yes

Obsolete

2.8 V

BICMOS

RF AND BASEBAND CIRCUIT

1

INDUSTRIAL

R-PBGA-B6

e2

1

85 °C

-40 °C

260

30

6

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

865 µm

1.27 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

ROHS COMPLIANT, WLP-6

compliant

8542.39.00.01